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. 2019 Feb 26;10(3):160. doi: 10.3390/mi10030160

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© 2019 by the authors.

Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).

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The influence of many factors on the thermoforming effect: (a) The infrared images of the temperature field for laminated structures with different heating times; (b) the angle of central deviation and the angle of edge warping for thermal bonding films with different thicknesses; (c) the angle of central deviation and the angle of edge warping for copper patterns with different copper line widths; (d) the illustration of α and θ; (e) the state of circuits under different thermal bonding film thicknesses and circuit widths; and (f–g) the experimental and FEM results of serpentine structures.