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. 2019 Mar 27;19(7):1484. doi: 10.3390/s19071484

Figure 4.

Figure 4

(a) Electroplated gold electrode chip stability in different conditions (1× PBS in RT, 1× PBS in 3 °C, 10% PBST, 10/50/90/100% glycerol in 1× PBS). (b) Sputtered gold electrode chip stability in different conditions (1× PBS in RT, 1× PBS in 3 °C, 10% PBST, 10/50/90/100% glycerol in 1× PBS). (c) Evaporated gold electrode chip stability in different conditions (1× PBS in RT, 1× PBS in 3 °C, 10% PBST, 10/50/90/100% glycerol in 1× PBS). (d) Standard deviation versus test environment.