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. 2019 Apr 16;24:103923. doi: 10.1016/j.dib.2019.103923

Table 1.

Process parameters for LTO annealing and NCG growth.

T, (°C) t, (min) Heat ramp (°C/min) PRF., (W) P, (mTorr) Ar flow (sccm) H2 flow (sccm) CH4 flow (sccm)
Heat-up 200↗900 15 3000 1500 75
Si/SiO2 (LTO) annealing 900 10 3000 1500 75
Hydrogen annealing 900 5 1500 1500 200
Deposition 900 120 100 1500 75 60
Cool-down 900↘200 9 1500 1500