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. 2019 May 20;5:20. doi: 10.1038/s41378-019-0059-0

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© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 6 — Fabrication process of a G-Cu composite cantilever and micromirror array. a Ti-Cu seed layer sputtering on a Si wafer and photolithography for electroplating; b G-Cu composite electroplating and resist removal; c Surface grinding, Ti-Cu etching and backside photolithography for patterning of the cantilever and micromirror; and d DRIE, resist removing and Ti-Cu etching