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. 2019 May 20;5:20. doi: 10.1038/s41378-019-0059-0

Table 1.

Deposition parameters of the G-Cu composite electroplating

Cu 50 g/l
H2SO4 25 g/l
Cl 40 mg/l
Graphene 0.28 g/l
Current density 18 mA/cm2
Temperature 25 °C