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. Author manuscript; available in PMC: 2019 May 31.
Published in final edited form as: Anal Chem. 2019 Mar 1;91(8):5011–5020. doi: 10.1021/acs.analchem.8b04963

Figure 4.

Figure 4.

Assessment of the binding interaction between Cu2+ ions and PEI-GA-PEI-functionalized NAA interferometers for different concentrations of Cu2+ ions (note: error bars denote standard deviation from average measurements obtained from n = 3 independent experiments). (a) Real-time Cu2+ binding stage for [Cu2+] = 75 ppm, where the arrows indicate ΔOTeff and tsat for the binding reaction performed under dynamic flow conditions (note: the dotted line shown at the left of the graph indicates the time point at which the Cu2+ analytical solution was injected into the flow cell system, OTeff and time baselines). (b) Average values of ΔOTeff for each surface chemistry engineering stage and real-time sensing. (c) Correlation between ΔOTeff (left scale) and tsat (right scale) with [Cu2+] for PEI-GA-PEI-functionalized NAA interferometers. (d) Kinetic rate (RPEI-GA-PEI-Cu) for the binding reaction between Cu2+ ions and PEI-GA-PEI functional layers for the range of [Cu2+] (i.e., 1–100 ppm).