Symbol	Nomenclature
fs	Spindle feed(µm/s)
nw	The rotational speed of workpiece (rpm)
ns	The rotational speed of grinding wheel (rpm)
H	Hardness (Gpa)
E	Elasticity modulus (Gpa)
Kc	The fracture toughness (Mpa m1/2)
$\rho$	The radius of curvature of grinding grains on the materials (mm)
F0	The contact load (mN)
FC	The contact load of C face (mN)
FSi	The contact load of Si face (mN)
P*	The critical load for brittle materials changing from plastic deformation to brittle fracture (mN)
P*C	The critical load for C face changing from plastic deformation to brittle fracture (mN)
φ	The proportion of magnetic particles in the MR fluids
h max	The maximum thickness of undeformed substrate (nm)
dc	The critical grit cutting depth (nm)
R	The radius of the grinding wheels (mm)
Lw	The circumference of layers of grinding material of the cupped grinding wheels (mm)
C	The concentration of grinding materials of diamond grinding wheels
Kβ	The coefficient relating to the shape of the grinding grains
dw	The radius of grinding grain (μm)
rm	The radius at any point on the surface of the workpieces
vd	The volume fraction of diamonds in the grinding wheel
hwp	The space between the workpieces and the lapping plates (mm)
Fin	The abrasive forces at the entrance of the polishing belts (μN)
S	The workpiece area (mm2)
PF	The polishing pressures (kPa)
Pm	The pressure produced by MR effects of the MR fluids (kPa)
Pd	The hydrodynamic pressure (kPa)
Pg	The buoyancy of MR fluids (kPa)
μ0	The magnetic inductivity of a vacuum
μ	The magnetic inductivity of magnetic particles
η	The initial viscosity of the MR fluids (Pa.s)
v	Speed of polishing disk (m/s)
Fv	The volume fraction of the layers of material in the grinding wheels (g⁄cm3)
P*Si	The critical load for Si face changing from plastic deformation to brittle fracture (mN)
Kb	The distribution coefficient of abrasives between the workpieces and lapping plates
Hm	The strength of the external magnetic fields (Gs)
h0	The distance from the polishing plates to the surfaces of workpieces (mm)
t	The thickness of workpieces (mm)
Δ	The machining gap (mm)
W	The tooth width of layers of grinding material of the cupped grinding wheels (mm)
Fw	The average pressure on single abrasive (mN)
SA	The actual contact area between a single abrasive and the workpieces (mm2)
p	The lapping pressure (kPa)
dg	The equivalent spherical diameter of diamond particles
f	The fraction of diamond particles that actively cut when grinding
d max	The maximum diameter of abrasives (mm)
F out	The abrasive forces at the exit of the polishing belts (μN)