Table 1. Key parameters for most of the operation modes discussed in this section.
Underlying simulations were based on 20 undulator modules available.
| Mode | Pulse energy | No. of photons per pulse at 1 nm | Pulse duration (r.m.s.) | Bandwidth (r.m.s.) | Comment |
|---|---|---|---|---|---|
| SASE (200 pC) | >1 mJ | 5 × 1012 | 30 fs | 0.1–0.4% | |
| SASE (10 pC) | >50 µJ (10 pC) | 2.5 × 1011 | 2 fs | 0.1–0.4% | |
| Self-seeding | ∼ 1 mJ | 5 × 1012 | 30 fs | < 10−4 | Above 1 nm, 200 pC only |
| Optical klystron | >1 mJ | 5 × 1012 | 30 fs | 0.1–0.4% | Shorter saturation length |
| HB-SASE | >1 mJ | 5 × 1012 | 30 fs | 0.01–0.13% | Can also be configured for pulse trains |
| High-power short-pulse | ∼300 µJ | 1.5 × 1012 | ∼250 as | 1% FWHM | 200 pC bunch |
| Two colours | 2 × ∼50 µJ | 2 × 2.5 × 1011 | 2 × 2–10 fs | 0.2%; tuning range: factor 5 | Based on 200 pC bunch |
| Large-bandwidth | ∼0.1 mJ | 5 × 1011 | 30 fs | >10% full width | 200 pC only |
| Slicing | 1 µJ (every 3 fs) | 5 × 109 | < 1 fs per pulse | 0.1–0.4% | Single pulse or pulse train; sub-femtosecond locking |