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. 2019 Jul 12;7:483. doi: 10.3389/fchem.2019.00483

Figure 1.

Figure 1

Major steps of the fabrication process for the chip with silicon lateral nanospikes. (A) UV lithography to define the shapes of micropillars and the microchannels; (B) deep reactive ion etching of silicon and silicon oxide; (C) MacEtch to produce lateral silicon nanospikes on the sidewalls and remove oxide using hydrofluoric acids.

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