Figure 1.

Schematics of the TP, the oscillation procedure, and the deposition efficiency. (a) A schematic illustration of the TP design. (b) A profile view of the deposition area, viewed toward the end of the orifice. (c) Oscillation procedure for depositing uniform thin films. The initial distance of the wafer edge and orifice is 1 mm. (d) Deposition efficiency, as measured by CPC. The aerosol number concentration measured through the heated TP, when a temperature gradient of 9.3 × 10⁴ K/m is applied over a 0.75 mm distance between the hot plate and the substrate, is approximately 2.5% of the concentration measured through a bypass line of similar path length, indicating a high deposition efficiency.