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. 2019 Jun 25;4(6):11126–11134. doi: 10.1021/acsomega.9b01003

Figure 4.

Figure 4

Postannealing process. (a) Resistivity of the Ni film as a function of annealing temperature. (b) XPS analysis of the film after annealing at 380 °C. (c) XRD result of the films before and after annealing. (d) Calculated grain size as a function of annealing temperature based on the fcc Ni (111) peaks in (c). (e) Tilted cross-sectional SEM images of the films before and after annealing. The number of ALD cycles is 300, and τNi is the thickness of the film.