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. 2019 Jul 1;9(7):960. doi: 10.3390/nano9070960

Figure 6.

Figure 6

(a) Stencil printing mask prepared by laser beam cutting with the thickness of 100 μm; (b) Stencil printing PECA patterns corresponding to the mask on the copper substrate playing the same role as Sn-Pb solders pastes; (c) Photographs of the relative resistance of the PECAs after curing; (d,e) Photographs of printable flexible circuits on a PET film. The printed circuits still maintained excellent adhesion performance during the bending process.