Table 1.
Comparison of PANIs’ improvement effect on ECAs cured with different curing agents.
| No. | Resin Composition (Mass Ratio) | Curing Process | Resistivity Change (×10−5 Ω·cm) | |
|---|---|---|---|---|
| Without PANIs | With 0.5 wt% PANIs | |||
| 1 | Epoxy: MeHHPA:DMP-30 = (100:85:0.5) | 150 °C 1 h | 286.8 | 26.1 |
| 2 | Epoxy:Triethanolamine = (100:16) | 120 °C 3 h | 16.7 | 8.8 |
| 3 | Epoxy:o-Tolylbiguanide = (100:14) | 140 °C 2 h | 252.2 | 38.3 |
| 4 | Epoxy:2-Ethyl-4-methylimidazole = (100:3) | 120 °C 1 h | 73.6 | 19.8 |
| 5 | Epoxy: Dicyandiamide = (100:8) | 180 °C 1 h | 34.1 | 21.4 |
| 6 | Self-made modified flexible epoxy resin | RT | 99.4 | 25.0 |