. 2019 Aug 3;19(15):3414. doi: 10.3390/s19153414

Table 1.

Deposition parameters of the Ni, Ni-20Cr, AlN and BCN thin films.

Coating	Bias MF [-V]	Target Power [W]	Heating Power [W]	Substrate Temperature [°C]	Chamber Pressure [mPa]	Gas Flow Rate Ratio
Ni	−150	2× 1875 DC (Ni)	1200	260 ± 9	250	Ar/Kr = 2.7
Ni-20Cr	−150	2× 1875 DC (Ni), 1× 1035 DC (Cr)	1200	265 ± 8	250	Ar/Kr = 2.7
AlN-1	−150	2× 3180 MF (Al)	5000	383 ± 4	330	Ar/N₂ = 6.0
AlN-2	−150	2× 3180 MF (Al)	7000	475 ± 7	330	Ar/N₂ = 6.0
AlN-3	−150	2× 3180 MF (Al)	3000	325 ± 8	330	Ar/N₂ = 5.1
BCN-1	−150	1× 3150 MF (B₄C)	7000	453 ± 3	330	Ar/N₂ = 26.0