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. 2019 Jul 24;12(15):2350. doi: 10.3390/ma12152350

Table 2.

Glass transition temperature (Tg) and indentation hardness (HIT) of cured photopatternable epoxy-based thermosets prior to and after UV exposure (74.5 mW cm−2).

Resin Formulation Tg [°C] HIT [MPa] Tg [°C] HIT [MPa]
Thermally Cured Photocleaved
epoxy-NBE/HHMPA 72 213.5 ± 19.8 48 110.9 ± 10.3
epoxy-NBE/HHPA 46 148.6 ± 13.8 32 83.0 ± 6.3
epoxy-NBE/DDSA 44 51.0 ± 4.7 30 41.3 ± 3.8
epoxy-NBE/GA 16 8.6 ± 0.8 12 1.3 ± 0.1