Table 2.
Resin Formulation | Tg [°C] | HIT [MPa] | Tg [°C] | HIT [MPa] |
---|---|---|---|---|
Thermally Cured | Photocleaved | |||
epoxy-NBE/HHMPA | 72 | 213.5 ± 19.8 | 48 | 110.9 ± 10.3 |
epoxy-NBE/HHPA | 46 | 148.6 ± 13.8 | 32 | 83.0 ± 6.3 |
epoxy-NBE/DDSA | 44 | 51.0 ± 4.7 | 30 | 41.3 ± 3.8 |
epoxy-NBE/GA | 16 | 8.6 ± 0.8 | 12 | 1.3 ± 0.1 |