Table 2.

Summary of published fabrication methods, materials, advantages, and disadvantages of p-DMF devices.

P-DMF Components	Method [References]	Materials	Advantages	Disadvantages
Conductive electrode arrays	Inkjet printing [3,4,28]	Carbon nanotube (CNT); silver nanoparticle (AgNP)	Rapid; can produce thin electrodes; programmable printing	Nozzle clogging
	Screen printing [65,66]	Carbon; silver	Rapid and low cost; can print high viscosity ink	Requires a mask; produces thick electrodes
	Spraying [67]	Graphite	Simple and low cost	Requires mask; low resolution
	Micro-syringe dispensing [68]	AgNP	Can print high viscosity ink	Complicated setup
	Ballpoint pen printing [69]	AgNP	Simple and low cost; can produce thin electrode	Requires a customized ballpoint pen
Dielectric-hydrophobic layer	Chemical vapor deposition (CVD) [3,4,28]	Parylene-C/Teflon	High quality coating; controllable coating thickness	Requires clean room facilities; expensive
	Spin coating [68]	Polydimethylsiloxane (PDMS)/silicon oil	Simple process	Difficult to coat large area; excessive material waste
	Taping [66]	Adhesive tape/Nevosil	Simple and low cost	Depends on the quality of a commercial tape
	Wrapping [65,69]	Paraffin film; plastic wrap/silicon oil	Simple and low cost	Depends on the quality of a commercial wrap