Table 1.
Milling depth in each COC layer and optical path length for various chip designs.
| Chip | Layer a (mm) | Layer b (mm) | Layer c (mm) | Optical Path Length |
|---|---|---|---|---|
| A | 1.0 | - | 1.0 | 2.0 |
| B | 0.5 | 2.0 | 0.5 | 3.0 |
| C | 1.0 | 2.0 | 1.0 | 4.0 |
| D | 1.5 | - | 1.5 | 3.0 |
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