Skip to main content
. 2019 Oct 16;19(20):4487. doi: 10.3390/s19204487

Figure 2.

Figure 2

(a) Typical packaging of a commercially available analogue MEMS condenser microphone (MEMS CMIC) (ADMP 504, Analog Devices Inc., Norwood, MA, USA) with the MEMS chip and the ASIC mounted on a printed circuit board (PCB) and enclosed with a metallic housing. (b) Schematic drawing of a MEMS CMIC with a typical configuration of the back plate and diaphragm (adapted from Reference [20]).