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. 2019 Oct 17;19(20):4497. doi: 10.3390/s19204497

Table 1.

Devices were fabricated following four different processes. No prime tol and no prime oDCB are processes without adhesion promoter, using as solvent toluene or oDCB respectively. During Ti prime tol and Ti prime oDCB processes the samples were treated with adhesion promoter (Ti prime) before spin coating of poly(3-hexylthiophene) (P3HT) dissolved respectively in toluene or in 1,2-dichlorobenzene (oDCB).

Process Solvent Adhesion Promoter
No prime tol Tol
Ti prime tol Tol
No prime oDCB oDCB
Ti prime oDCB oDCB