Figure 1.

Nanostructured PI fabrication process flow. Ultrathin Cu film is deposited on a glass (FS) substrate by sputtering (a). Thermal dewetting creates Cu nanoparticles (b) that are partially covered with spin-coated PI (c). Finally, the Cu particles are removed by chemical etching leading to a PI nanohole array (d). SEM (left) and AFM (right) images of the final PI nanohole array structure on glass (e).