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. 2019 Dec 6;10:5597. doi: 10.1038/s41467-019-13507-5

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© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 3 — Characterization of DCIMP. a A small-sized digit 8 pattern enabling the measurement of line width and density. Scale bar: 25 nm. b Force-distance (FD) curve-based AFM (FD-based AFM) characterization of nanomechanical properties of metalized patterns. The error bars are the standard deviation for N = 25 and 25 samples with the origami and the metalized patterns, respectively. c Cu plating on a whole triangular origami with STEM and elemental mapping characterization. Scale bar: 50 nm. d Ag plating on a whole triangular origami with STEM and elemental mapping characterization. Scale bar: 50 nm.