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. 2019 Dec 12;9:18977. doi: 10.1038/s41598-019-55031-y

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© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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COMSOL simulation results. As shown in Fig. 3, the numerical analysis agrees with the measured results. (a) A perspective view of the DEP device in Fig. 1(d). The temperature increase between the IDEs is shown. (b) Cross-sectional view along AA’ in (a). The highest temperature increase occurs on the SiN membrane between the IDEs. (c) Temperature profile from the center of the SiN membrane (0 μm) to water in the z-direction.