Table 2.
Various types of printing methods used for the fabrication of flexible/stretchable tactile sensors.
| Year | Fabrication technique | Printer used | Minimum detail | Printed component | Transduction principle | Ref. |
|---|---|---|---|---|---|---|
| 2019 | Fused filament fabrication (FFF) | Customized FFF printer | — | Sensing element | Piezoresistive | [236] |
| 2019 | Fused filament fabrication (FFF) | MakerBot 2X replicator | 200 μm | Sensing element, sensor body | Piezoresistive | [237] |
| 2019 | Fused filament fabrication (FFF) | Customized LulzBot | — | Sensing element | Capacitive | [181] |
| 2019 | Aerosol jet printing | Self-built printer | ~10 μm | Sensing element | Piezoresistive | [238] |
| 2019 | Direct ink writing | Self-built printer | — | Sensing element | Piezoresistive | [239] |
|
| ||||||
| 2018 | Fused filament fabrication (FFF) | Standard FFF printer | — | Sensor body, sensing element | Piezoresistive | [130] |
| 2018 | Inkjet printing | Enjet Corp., Korea | 60 μm | Sensor electrode | Piezoresistive | [240] |
| 2018 | Inkjet printing | Canon IP100 | — | Sensing element | Capacitive | [213] |
| 2018 | Direct ink writing | Self-built printer | 60 μm | Sensing element | Piezoresistive | [149] |
| 2018 | Direct ink writing | Glass micropipette | — | Sensor electrodes | Capacitive | [82] |
| 2018 | Direct ink writing | Home-built 3D printer, Cura Ultimaker | 400 μm | Sensing element | Capacitive | [191] |
| 2018 | Direct ink writing | Custom-built printer | — | Whole sensor | Piezoresistive | [212] |
| 2018 | Direct ink writing | Self-built printer | 300 μm | Sensing element | Piezoresistive | [241] |
| 2018 | Direct ink writing | Home-built 3D printer | 400 μm | Sensing element | Capacitive | [242] |
|
| ||||||
| 2017 | Fused filament fabrication (FFF) | MakerBot 2X replicator | 100-300 μm | Sensor body, sensing element | Piezoresistive | [243] |
| 2017 | Fused filament fabrication (FFF) | MakerGear M2 | 50 μm–0.25 mm | Sensing element | Piezoresistive | [244] |
| 2017 | Inkjet printing | ProJet 5500X | ~30 μm | Sensor body | Piezoresistive | [9] |
| 2017 | Inkjet printing | — | — | Sensor electrode | Piezoresistive | [245] |
| 2017 | Inkjet printing | MicroFab jetlab II | — | Dielectric layer | Capacitive | [198] |
| 2017 | Inkjet printing | jetlab4, MicroFab | 170 nm | Sensor element | Piezoelectric | [246] |
| 2017 | Direct ink writing | Custom-built 3D printer | — | Sensor body, sensing element | Piezoresistive | [231] |
| 2017 | Direct ink writing | Self-built | — | Sensing element | Piezoresistive | [247] |
| 2017 | Direct ink writing | Self-built printer | Trace width—100 μm | Sensing element and electrodes | Capacitive | [109] |
| 2017 | Electrohydrodynamic (EHD) | Self-built printer | 15 μm | Sensing element | Capacitive | [235] |