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. 2019 Nov 28;10(12):827. doi: 10.3390/mi10120827
MEMS Microelectromechanical systems
HF High-frequency
DIW Direct ink writing
EHD Electrohydrodynamic printing
LAED Laser-assisted electrophoretic deposition
LIFT Laser-induced forward transfer
MCE Meniscus-confined electroplating
ELD Electroplating of locally dispensed ions in liquid
DLW Direct laser writing
MDLW Metal direct laser writing
3D Three-dimensional
NA Numerical aperture
AOM Acousto-optical modulator
EDX Energy-dispersive X-ray spectroscopy
PET Polyethylene terephthalate
OFET Organic field effect transistor
PMMA Polymethyl methacrylate
SEM Scanning electron microscopy
PDMS Polydimethylsiloxane
ODMR Optically detected magnetic resonance
SERS Surface-enhanced Raman scattering
4-MBT 4-methylbenzenethiol
PVP Poly(vinylpyrrolidone)
TE Transversal electric
NDSS N-decanoylsarcosine sodium
2D Two-dimensional
TGA Thermogravimetric analysis
DSC Differential scanning calorimetry
DLP Digital light processing
PEGDA Polyethylene glycol diacrylate