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. 2020 Jan 7;20(2):337. doi: 10.3390/s20020337

Figure 3.

Figure 3

Manufacturing process of the proposed pressure sensor (a) SOI wafer, (b) ion impantation, (c) the electrode preparation, (d) sputtering deposition, (e) BF33 wafer, (f) bonding, (g) CMP and erching, (h) bonding and polishing, (i) dicing and separating.