| BOE | Buffered Oxide Etch |
| CPD | Critical Point Drying |
| EBL | Electron Beam Lithography |
| HF | Hydrofluoric Acid |
| HSQ | Hydrogen Silsesquioxane |
| ICPRIE | Inductively Coupled Plasma Reactive Ion Etching |
| NMP | N-Methyl-2-Pyrrolidone |
| PMMA | Poly Methyl Methacrylate |
| SOI | Silicon-on-Insulator |
| ZEP | Methylstyrene |
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