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. 2020 Jan 24;13(3):567. doi: 10.3390/ma13030567
Parameter Definition Units
a Chip thickness mm
a0 Undeformed chip thickness mm
A Initial yield stress MPa
AX Amplitude of vibration in x-axis μm
AY Amplitude of vibration in y-axis μm
α Main shear zone -
αT Coefficient of thermal deformation °C−1
b Shear band thickness mm
B Hardening constant MPa
β Angular mismatch Rad
C Strain rate coefficient -
CP Specific heat J/kg·°C
D Density kg/m3
E Elastic modulus GPa
ε´ Strain rate s−1
ε´0 Initial strain rate s−1
f Cutting feed mm/rev
f0 Vibration frequency kHz
FC Cutting force N
ξ Compression ratio -
Li Length of segment mm
m Coefficient of thermal softening -
n Coefficient of strain hardening -
NC Cutting power consumption W
QW Material removal rate mm3/s
RSCE Relative specific cutting energy -
SCE Specific cutting energy W∙s/mm3
Tmelt Melting temperature °C
Troom Room temperature °C
Vc Cutting speed m/min
Vi Normal component of the speed of each segment mm/s
Vo Output chip velocity m/min
ϕ Shear plane angle °