Table 3.
Type of photocathode | Fabrication process | Hydrogen evolution reaction | Thickness of CuO | Refs. |
---|---|---|---|---|
CuO thin film | RF‐magnetron sputtering | ≈2 µmol h−1 | 500 nm | 38 |
Au‐Pd‐decorated CuO thin film | RF‐magnetron sputtering | ≈2.6 µmol h−1 | 500 nm | 38 |
CuO thin film with TiO2 protecting layer (CuO‐TiO2) | Sol–gel method | ≈2.1 µmol h−1 | ≈500 nm | This work |
CuO thin film with TiO2 protecting layer and Au‐Pd co‐catalyst nanostructures (CuO‐TiO2‐AuPd) | Sol–gel method and RF sputtering | ≈2.5 µmol h−1 | ≈500 nm | This work |
–COOH‐functionalized graphene into the CuO film with TiO2 protecting layer (CuO:G‐COOH)‐TiO2 | Sol–gel method | ≈2.3 µmol h−1 | ≈500 nm | This work |
–COOH‐functionalized graphene into the CuO film with TiO2 protecting layer and Au‐Pd co‐catalyst nanostructures (CuO:G‐COOH)‐TiO2‐AuPd | Sol–gel method and RF sputtering | ≈3.0 µmol h−1 | ≈500 nm | This work |