Table 1.
Adhesive | Primary Ingredients | pH | Experimental Groups | n | Adhesive System Applied |
---|---|---|---|---|---|
Scotchbond Universal (3M ESPE, St. Paul, MN, USA), Lot #587502 |
10-MDP; HEMA; Bis-GMA; ethanol; TEGDMA; silane treated silica; water; CQ | 2.95 | SBU-ER | 5 | Etch-and-rinse |
SBU-SE | 5 | Self-etch | |||
Futurabond M+ (VOCO GmbH, Cuxhaven, Germany), Lot #1624201 |
HEMA; Bis-GMA; ethanol; Acidic adhesive Monomer; UDMA; pyrogenic silicic acids | 1.9 | FUT-ER | 3 | Etch-and-rinse |
FUT-SE | 3 | Self-etch | |||
AE1 (experimental adhesive formulated with Bis-GMA) |
10-MDP; Bis-GMA; HEMA; UDMA; TEGDMA; water; etanol; CQ | 2.09 | AE1-ER | 3 | Etch-and-rinse |
AE1-SE | 5 | Self-etch | |||
AE2 (experimental adhesive formulated with G-IEMA) |
10-MDP; G-IEMA; HEMA; UDMA; TEGDMA; water; etanol; CQ | 3.5 | AE2-ER | 5 | Etch-and-rinse |
AE2-SE | 3 | Self-etch |
10-MDP: 10-methacryloxydecyl dihydrogen phosphate; HEMA: hydroxyethyl methacrylate; Bis-GMA: bisphenol a diglycidyl ether dimethacrylate; TEGDMA: 1,10-decamethylene glycol dimethacrylate; CQ: camphorquinone, G-IEMA: dendrimer of generation (2) derived from isocyanatoethyl methacrylate; SBU: Scotchbond Universal™); FUT: (Futurabond M+™); ER: Etch & Rinse; SE: Self Etch.