HTC	Heat transfer coefficient (between steam and metallic substrate), kW m−2 K−1
k	coverage factor, -
q	Heat flux, kW m−2
T	Temperature, K
z	Orthogonal axis of the sample, m
Greek symbols
ΔT	Temperature difference, K
λ	Thermal conductivity, W m−1 K−1
θ	Contact angle, °
Subscripts
a	Advancing
r	Receding
sat	Saturation
wall	Surface