Table 2.

Advantages and disadvantages of various types of materials used in the indirect bonding technique [4,5,8,15,16,17].

Enamel Preparation	Adhesive on Bracket Base	Sealant	Advantages	Disadvantages
AET	CC	CC(2 components, (catalyst on bracket base and universal unfilled resin on enamel)	-Less failures than in Silvermann’s technique [5] -Better control of the material amount [4]	-Limited time for bracket placement [8,15] -Incomplete curing of sealant [5,8]
AET	TC	CC(2 components, mixed before application)	-Unlimited time for bracket placement [8] -Reduced risk of material excess [8]	-Lower SBS in comparison to LC and CC bracket bases [5,16] -Not recommended for ceramic brackets [16]
AET	LC	CC (2 components, mixed before application)	-Unlimited time for bracket placement [8] -Fast polymerization [8,15] -Reduced risk of material excess [5,8] - Bond strengths similar to the DB [15]	The risk of bonding failure between sealant and composite [5]
SET	LC	SET, LC (2 components, mixed before an application)	Reduced amount of adhesive after debonding (lower ARI) in comparison to AET [17]	Lower SBS than AET [17]

Legend: TC—thermally cured material; CC—chemo-cured material; LC—light-cured material; SBS—shear bond strength; SET—self-etch technique; AET—acid-etch technique; DB—direct bonding