Table 3. Dimensions and currents used for each milling pattern during automated sequential lamellae preparation.
| Milling Pattern # | Pattern Attributes |
|---|---|
| Milling pattern 1 and 2 (Rough Milling 1) |
30 kV 700 pA 9 × 5 µm rectangle Generates 2 µm thick lamella |
| Milling Pattern 3 and 4 (Rough Milling 2) |
30 kV 300 pA 8 × 2 µm rectangle Generates 1 µm thick lamella |
| Milling Pattern 5 and 6 (Rough Milling 3) |
30 kV 100 pA 7.5 × 1 µm rectangle Generates 500 nm thick lamella |
| Milling Pattern 7 and 8 (Lamella Polishing) |
30 kV 50 pA 7 × 0.5 µm rectangle Generates 300 nm thick lamella |
| Drift Correction Pattern (Rough Milling and Polishing) |
3 × 3 µm rectangle |