Table 2.

Vapor‐phase‐deposited polymers for patterning

Approach	Key element		CVD	Polymera)	Substrate	Resolutionb)	Ref.
Masking	Metal shadow mask		oCVD	PEDOT	Paper, Plastic films	<1 cm	38, 117
	Micro‐stencil		Pyrolysis	PPXPF‐co‐PX	Thermoplastics	≈150 µm	73
		Photomask	iCVD	P(Vcin‐co‐NIPAAm), P4VP, PoNBMA	Si, Glass rods	10–50 µm	74, 124
			MLDc)	Polyurea	Si	4 µm	71, 125
E‐beam	No crosslinking		MLD	Polyurea	Si	<50 nm	126
Pre‐patterns		Transition metals	iCVD	P4VP, PPFDA, PoNBMA, PPFM	Si, Paper	<1 cm	61, 62, 63
	Inhibitor	Metals + electrical charge	Pyrolysis	Parylene	Metal	<100 µm	70
		SAMd)	Pyrolysis	Parylene	Si, Au	≈3 µm	30
		DPNe)	VPP	PEDOT	Si, Au	250 nm	127
	Oxidant	Inkjet	VPP	PEDOT	Glass, Plastic films	80–100 µm	128
DSAf)		Topcoat	iCVD	PDVBg)	Si	<10 nm	41

^a)Polymer name abbreviations. P(PXPF‐co‐PX): poly(p‐xylylene‐4‐carboxylic acid pentafluorophenolester‐co‐xylyene); P(Vcin‐co‐NIPPAm): poly(vinylcinnamate); P4VP: poly(4‐vinyl pyridine); PoNBMA: poly(ortho‐nitrobenzyl methacrylate); PPFDA: poly(1H,1H,2H,2H‐perfluorodecyl acrylate); PPFM: poly(pentafluorophenyl methacrylate)

^b)Highest resolution shown in the literature

^c)MLD: Molecular layer deposition

^d)SAM: self‐assembled monolayer

^e)DPN: dip‐pen lithography

^f)DSA: directed self‐assembly

^g)PDVB: poly(divinylbenzene)

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