Table 2.
Comparison of different techniques used for the fabrication of chipless sensors.
| Fabrication Technique |
Typical Resolution | Suitable for Flexible Substrates | Suitable for Mass Production | Used for Sensing Material |
|---|---|---|---|---|
| Microlithography | >1 μm | Partially | Yes | Yes |
| Inkjet printing | 20–50 μm | Yes | Limited | Yes |
| Aerosol printing | 5–10 μm | Yes | No | Yes |
| Screen printing | 50 μm | Yes | Yes | Yes |
| CNC Milling | >20 μm 1 | No | Limited | No |
| Embroidery | >0.5 mm | Yes | Limited | No |
| Drop casting | - | Partially | Yes | Yes |
| Thermocompressive bonding | >20 μm 1 | Partially | Limited | Yes |
1 Strongly dependent on dimensions and process parameters.