Table 1.
Technology | Min. Feature Size | Material | Ref. |
---|---|---|---|
Selective laser sintering | <400 µm | Div. Polymers | [21,22] |
Fused deposition modeling | 200 µm | Diverse polymers | [23] |
Robot dispensing | 200 µm | Hydrogels | [24] |
Stereolithography | 30–70 µm | Photosensitive polymers | [25] |
3D inkjet printing | 28 µm | Photoresist | [24] |
Resonant direct laser writing | 1–4 µm | IP-Dip photoresist | [26] |
Multiphoton absorption polymerization | 1 µm | SU8 photoresist | [27] |
Two-photon polymerization | 0.28–1.5 µm | Photoresists | [28] |
Direct laser writing | 0.085–1.5 µm | Photoresists | [29] |