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. 2020 Apr 29;11(5):469. doi: 10.3390/mi11050469

Figure 4.

Figure 4

(a) procedures for extracting Sa, Sq and Sz and 2D profiles from wire electrical discharge machining (WEDM) machined microchannels, (b) measuring the recast layer area from a scanning electron microscope (SEM) image by using ImageJ software.