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. Author manuscript; available in PMC: 2020 Jun 23.
Published in final edited form as: J Prosthet Orthot. 2018 Oct;30(4):214–230. doi: 10.1097/jpo.0000000000000209

FIGURE 2A,B.

FIGURE 2A,B.

WAFER sensor. (A) The WAFER antenna, thermistor, capacitor, and lead wires were affixed to the back surface of the plastic shell (lower part of image). The inside surface of the shell (upper part of image) faced the liner. (B) Top-view of socket showing WAFER sensor positioned within a socket.