TABLE V.

Geometry Definitions for Finite-Element Analysis

Parameter	Variable	Value [in]	Source
Board layers	layers	14	Design
Board stack-up	t_stackup	0.124	Calculated from below parameters
Dielectric thickness	t_dielectric	0.0076	Microsection
Hole diameter	hole_diameter	0.012	Design (nominal value)
Cap plating thickness	t_cap	0.003	Microsection
Wrap plating thickness	t_wrap	0.0005	IPC-6012B 3/A
Barrel plating thickness	t_barrel	0.0017	Microsection
External foil thickness	t_extfoil	0.0007	Microsection
Internal foil thickness	t_intfoil	0.0014	Microsection
Annular ring/pad size	EAR	0.0155*8	Design, 20% reduction per IPC-6012B 3/A
Etchback	etchback	0.00035	Microsection