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. Author manuscript; available in PMC: 2020 Jul 7.
Published in final edited form as: IEEE Trans Reliab. 2018 Aug 7;68(1):248–266. doi: 10.1109/tr.2018.2835140

TABLE VI.

Material Definitions for Laminates, Via Fills, and Copper

Tg
[°C]		 α1/α2
[ppm/°C]		 Cp
[J/gK]		 ρ
[lb/in3]		 k
[W/mK]		 E [ksi] λ
Laminate
Isola P95 260 {13,14,55} 0.95 0.058 0.2 3892 0.187
Arlon 85N 250 {16,16,55}/{16,16,149} 0.94 0.058 0.2 3200 0.15
Nelco N7000-2 HT 260 10 1.06 0.061 0.45 3100 0.146
Rogers R04350B 280 {10,12,32} 0.9 0.067 0.69 2432 0.4
Duroid 6002 N/A {16,16,24} 0.93 0.076 0.6 120 0.4
Isola HR370 180 {13,14,45}/{14,17,230} 0.94 0.058 0.4 3744 0.177
Via Fill
Taiyo THP-100DX1 VF 155 32/81 900 0.059 0.58 652.67 0.34
DuPont CB100 115 27/47.2 309 0.2 3.5 2000 0.34
Copper
Copper foil N/A 17.7 385 0.32 391 17000 0.35
Electroplated copper N/A 17.7 385 0.32 401 18850 0.34

Tg = glass transition temperature, α1/α2 = coefficient of thermal expansion (CTE) below/above Tg, Cp = specific heat capacity at constant pressure, ρ = density, k = thermal conductivity, E = elastic modulus, λ = Poisson’s ratio