TABLE VII.

Compilation of Simulation Results for Maximum Strains

Wrap Thickness Sweep
Wrap Thickness [in]		Barrel Strain	Wrap Strain	Wrap Edge Strain
0.0006		0.017	0.019	0.012
0.0004		0.017	0.021	0.012
0.0002		0.017	0.019	0.012
0		0.017	0.017*	0.012
Electroplated Copper Property Sweep
Elastic Modulus [ksi]	Poisson’s Ratio	Barrel Strain	Wrap Strain	Wrap Edge Strain
E=18855	λ = 0.34	0.017	0.020	0.012
E+10%=20740		0.017	0.020	0.013
E−10%=16969		0.016	0.020	0.012
E=18855	λ+10%=0.374	0.016	0.019	0.012
	λ−10%=0.306	0.017	0.021	0.013
Laminate and Via Fill Material Mix
Laminate	Via Fill	Barrel Strain	Wrap Strain	Wrap Edge Strain
Isola P95	Taiyo THP-100DX1 VF	0.017	0.020	0.012
	DuPont CB100	0.015	0.014	0.012
Arlon 85N	Taiyo THP-100DX1 VF	0.017	0.020	0.013
	DuPont CB100	0.016	0.014	0.012
Nelco N7000–2 HT	Taiyo THP-	0.014	0.020	0.010
	100DX1 VF
	DuPont CB100	0.013	0.014	0.010
Rogers R04350B	Taiyo THP-100DX1 VF	0.015	0.020	0.011
	DuPont CB100	0.013	0.014	0.011
Duroid 6002	Taiyo THP-100DX1 VF	0.015	0.020	0.012
	DuPont CB100	0.015	0.014	0.012
Isola HR370	Taiyo THP-100DX1 VF	0.045	0.021	0.022
	DuPont CB100	0.046	0.021	0.022

^*Given no wrap, this is the strain value at the via barrel to cap plating interface as depicted in Figure 25.