Table 1.
Step by step procedures for the fabrication of the low-power, wireless optoelectronic devices.
| Process | Purpose | Equipment/Tools (Model Name/Manufactures) | Progress 1 |
|---|---|---|---|
| 1. Preparation of Cu/PI film | Preparation of the films for defining patterns | PI/Cu film (AC181200R, DupontTM Pyralux®) glass Kapton tape |
5% |
| 2. UV photo-lithography | Define the patterns | Cleanroom (AggieFab) Spin-coater (G3 P-8, Specialty Coating Systems) Hotplate (SP88850200, Fisher ScientificTM) Mask aligner (EVG®610, EV Group) Photoresist (AZ 1518, AZ®) Developer (AZ Developer 1:1, AZ®) Copper etchant (Alfa Aesar™) |
30% |
| 3. Components soldering | Mount electrical components on the pattern | Microscope (SPZV 50E, AVEN) Solder cored wire flux (397952, Multicore®) Solder stations (WD1002/WP80, Weller) Stainless steel wire (75,000 psi tensile strength, and 0.008’’ diameter, McMaster-Carr) UV epoxy (MED-OG198-54, Epoxy Technology) |
60% |
| 4. 1st testing | Function verification | Transmit power system (FEIG electronic) Magnets |
70% |
| 5. PDMS encapsulation | Device packaging | Vacuum ovens (Accu Temp 1.9, AI) PDMS (SylgardTM 184 silicone elastomer kit, Dow®) |
95% |
| 6. 2nd testing | Device validation | Transmit power system (FEIG electronic) Magnets |
100% |
1Progress (%) is based on the step-wise required time per total required time.