Reducing the size of droplet |
For large conductivity (≥10−4 S/m) |
Reducing flow rate, increasing voltage |
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For small conductivity (<10−4 S/m) |
Reducing flow rate, minimizing diameter of nozzle outlet |
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Increasing precision of placement |
Keeping a small distance between nozzle and substrate |
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Increasing yielding rate |
Increasing numbers of nozzle |
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Alleviating end effects from neighboring nozzle |
Inserting nonconductive/dummy nozzles; inserting metal nozzles into nonconductive materialbased multinozzle structure; increasing distance between neighboring nozzle; changing the shape of nozzle array |
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Eliminating disturbance due to surface irregularity of the substrate, such as uneven surface, restriction of standoff distance, nonconductive material |
Changing configuration of electrodes, such as nozzlering type; applying sinusoidal AC voltage and print droplet whose charge alternates between positive and negative charges |