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. 2020 Feb 23;22(2):254. doi: 10.3390/e22020254
S Entropy generation, J kg−1 K−1
Q Heat, J
T Temperature, K
Ein Input energy, J
w˙ Heat dissipated at a certain temperature, J/s
W Light output energy, J
Eirr Irreversible energy, J
P Power
t Time, s
U Voltage drop, V
I Electric current, A
λ Wavelength, nm
R Resistance
Se External entropy generation
Si Internal entropy generation
Qe Heat dissipated into the environment, J
Klim Limit constant
Cp Capacitance of pyroelectric material
η Absorption coefficient of radiation
A Electrode area, m2
Tf Final temperature, K
Ti Initial temperatures, K
ψ Exergy
G Specific enthalpy, J/kg
R Thermal resistance
a Ambient
c Case
CS Case-to-sink
FoM Related to the figure of merit
in Input
j Junction
η Second law coefficient
Zpower Uniformity coefficient
T(X) Temperature-dependent distance, K
Nf Total number of cycles to failure
F Driving force, N
P Pressure
T(t) Temperature-dependent time, K
Jp Heat flux through the boundary
W(t) Work by deformation
V Solder volume
kT Thermal energy
D Diffusivity
N Avogadro’s number
M Mass rate
q Heat flux
gradT Temperature gradient
tf Failure time
C Heat capacity
h Convective heat transfer coefficient
DN Damage parameter
Qcyc Unit cycle energy, J
k Wear coefficient
Har Hardness pressure
L Normal load
B (dw/ds) for a particular process
jc Junction-to-case
ja Junction-to-ambient
p Related to processor
out Outlet
S Sink
sa Sink-to-ambient