| NiO–CuO thin
film |
850 |
sol–gel spin coating |
–1.07 mA/cm2 at –0.55 V (Ag/AgCl) |
(24) |
| CuO thin film |
∼500 |
sputtering |
–0.65 mA/cm2 at –0.45 V (Ag/AgCl) |
(66) |
| Li-doped CuO nanoparticles |
1700 |
flame spray pyrolysis |
–1.7 mA/cm2 at –0.55 V (Ag/AgCl) |
(27) |
| CuO thin film |
500 |
RF-magnetron sputtering |
–3.1 mA/cm2 at 0 V (RHE) |
(67) |
| CuO nanoparticles films |
1340 |
spin coating |
–1.2 mA/cm2 at –0.55 V (Ag/AgCl) |
(68) |
| CuO thin film with TiO2 protecting layer and Au–Pd co-catalyst nanostructures (CuO–TiO2–AuPd) |
∼500 |
sol–gel method and RF
sputtering |
–1.9 mA/cm2 at 0 V vs RHE |
(69) |
| tenorite CuO thin films |
∼500 |
spray pyrolysis |
–24 mA/cm2 at 0.25 V vs
RHE |
(33) |
| Cu2O/CuO/C |
∼2000 |
electrodeposition |
–7.5 mA/cm2 at –0.1 V vs RHE |
(70) |
| CuO |
∼700 |
spin coating |
–19.12 mA/cm2 at –1 V vs RHE |
present work |