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. Author manuscript; available in PMC: 2020 Oct 8.
Published in final edited form as: J Electrochem Soc. 2018;166(1):https://doi.org/10.1149/2.0091901jes.

Figure 1.

Figure 1.

Integration architecture of the mesoscale Cu TSV, integrated with a device fabricated on a silicon-on-insulator substrate.