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. Author manuscript; available in PMC: 2020 Oct 8.
Published in final edited form as: J Electrochem Soc. 2018;166(1):https://doi.org/10.1149/2.0091901jes.

Figure 4.

Figure 4.

Sketch of the analogous Cu growth in different recessed features. The feature geometry and poloxamine Tetronic 701 concentration enable the bottom-up Cu filling, although convection may also affect deposition, as demonstrated in Fig. 3.