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. Author manuscript; available in PMC: 2020 Oct 8.
Published in final edited form as: J Electrochem Soc. 2018;166(1):https://doi.org/10.1149/2.0091901jes.

Figure 5.

Figure 5.

TSV filling after 6 hrs at a) −0.74 V(SSE), b) −0.70 V(SSE), c) −0.66 V(SSE), d) −0.64 V(SSE) in 1.25 mol/L CuSO4 −0.25 mol/L CH3SO3H − 1 mmol/L Cl− electrolyte with 50 μmol/L poloxamine Tetronic 701. The vias were electroplated on approximately 1 cm by 2 cm samples and rotated at 400 rpm.