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. Author manuscript; available in PMC: 2020 Oct 8.
Published in final edited form as: J Electrochem Soc. 2018;166(1):https://doi.org/10.1149/2.0091901jes.

Figure 6.

Figure 6.

TSV filling at −0.64 V(SSE) for a) 2 hr, b) 4 hr, c) 6 hr in 1.25 mol/L CuSO4 −0.25 mol/L CH3SO3H − 1 mmol/L Cl− electrolyte with 50 μmol/L poloxamine Tetronic 701. The vias were electroplated on approximately 1 cm by 2 cm samples and rotated at 400 rpm.