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. Author manuscript; available in PMC: 2020 Oct 8.
Published in final edited form as: J Electrochem Soc. 2018;166(1):https://doi.org/10.1149/2.0091901jes.

Figure 9.

Figure 9.

TSV filling after 20 hr in 1.25 mol/L CuSO4 −0.25 mol/L CH3SO3H - 1 mmol/L Cl− electrolyte with 50 μmol/L poloxamine Tetronic 701. The vias were electroplated on approximately 1 cm by 2 cm samples at −0.62 V(SSE) in solution that was nominally static throughout deposition. All the TSVs contain a central seam void reflecting conformal deposition within the recessed features; seams disappear toward the left due to polishing that is not parallel to the features as is also reflected in their narrowing toward the left.