Table 2.
Young’s modulus of the different adhesive systems used in the experimental study.
| Designation | Type of Adhesive | Young’s Modulus (MPa) | Standard Deviation (MPa) |
|---|---|---|---|
| Adhesive A | Bi-component epoxy system used in construction (highly thixotropic paste) | 11,200 1 | - |
| Adhesive B | Bi-component epoxy system suitable for bonding variety of materials (high viscosity liquid adhesive) | 205 | 5 |
| Adhesive C | Bi-component epoxy system suitable for bonding wide variety of materials (fast cure adhesive) | 4.8 | 1.3 |
| Silicone 1 | Mastic silicone used for sealing and bonding applications | 0.7 | 0.3 |
| Silicone 2 | Silicone rubber used to protect strain-gauge installations | 1.1 | 0.4 |
1 Value provided by the manufacturer on the technical data sheet.